PSC Code 3670 covers specialized machinery specifically designed for the manufacturing of semiconductors, microcircuits, and printed circuit boards. This includes equipment used in substrate preparation, circuit pattern formation, and interconnecting and packaging processes. Government agencies utilize this PSC to procure advanced manufacturing technology essential for producing high-reliability electronic components critical to defense, aerospace, and other high-technology applications. The code excludes assembly machines for mounting discrete components on printed wiring boards, focusing instead on the specialized machinery integral to the fabrication of semiconductor devices and microcircuits.

Contracting under this PSC ensures that government buyers acquire precision manufacturing equipment tailored to the unique requirements of semiconductor and printed circuit board production. This machinery supports the government’s need for cutting-edge electronics manufacturing capabilities, underpinning national security and technological innovation programs. By categorizing these specialized machines under PSC 3670, agencies can streamline procurement and align acquisitions with specific industrial standards and technical specifications.

Includes for PSC 3670

This PSC code covers the following products and services:

Substrate Preparation Equipment; Circuit Pattern Forming Equipment; Interconnecting and Packaging Equipment.

Excludes for PSC 3670

This PSC code does NOT cover the following:

Assembly Machines for Mounting Discrete Components on Printed Wiring Boards.

Additional Notes for PSC 3670

Important notes and guidance for using this PSC code:

This class includes, and is restricted to, equipment specifically designed for manufacturing semiconductor devices (FSC 5961), microcircuits (FSC 5962), and printed circuit boards (FSC 5998). Excludes items for which more suitable classes are specifically prescribed by the indexes and structure of the FSC.

Typical Buyers & Agencies for PSC 3670

Typical buyers under PSC 3670 include defense agencies such as the Department of Defense, the Department of Energy’s national laboratories, and agencies involved in advanced research and development of electronic components. These buyers require specialized manufacturing machinery for producing semiconductor devices and printed circuit boards used in weapons systems, aerospace applications, and critical infrastructure technologies. Additionally, government research institutions and contractors supporting classified and high-technology projects frequently procure equipment classified under this PSC to ensure compliance with technical standards and operational requirements.

Common Contract Types for PSC 3670

Contracts awarded under PSC 3670 commonly include firm-fixed-price, cost-reimbursement, and indefinite-delivery indefinite-quantity (IDIQ) contracts depending on the complexity and customization of the machinery. Procurement methods involve competitive bidding, negotiated procurements, and requests for proposals (RFPs) due to the specialized nature of the equipment. These contracts often require vendor expertise in advanced manufacturing technologies and may include performance-based specifications to guarantee machinery meets stringent quality and operational criteria.

Plain-Language Breakdown for PSC 3670

Covers machinery specifically designed for semiconductor, microcircuit, and printed circuit board manufacturing.
Includes substrate preparation, circuit pattern forming, and interconnecting and packaging equipment.
Excludes assembly machines for mounting discrete components on printed wiring boards.
Primarily used by defense and research agencies requiring advanced electronic manufacturing technologies.
Contracts often involve firm-fixed-price and cost-reimbursement types with detailed technical specifications.
Commonly aligned with NAICS codes 333242, 334413, and 334412 for semiconductor and PCB manufacturing.

Related Categories for PSC 3670

Other categories at the same level as 3670

3605 FOOD PRODUCTS MACHINERY AND EQUIPMENT

Food Products Machinery and Equipment

3610 PRINTING, DUPLICATING, AND BOOKBINDING EQUIPMENT

Printing, Duplicating, and Bookbinding Equipment

3611 INDUSTRIAL MARKING MACHINES

Industrial Marking Machines

3615 PULP AND PAPER INDUSTRIES MACHINERY

Pulp and Paper Industries Machinery

3620 RUBBER AND PLASTICS WORKING MACHINERY

Rubber and Plastics Working Machinery

3625 TEXTILE INDUSTRIES MACHINERY

Textile Industries Machinery

3630 CLAY AND CONCRETE PRODUCTS INDUSTRIES MACHINERY

Clay and Concrete Products Industries Machinery

3635 CRYSTAL AND GLASS INDUSTRIES MACHINERY

Crystal and Glass Industries Machinery

3640 TOBACCO MANUFACTURING MACHINERY

Tobacco Manufacturing Machinery

3645 LEATHER TANNING AND LEATHER WORKING INDUSTRIES MACHINERY

Leather Tanning and Leather Working Industries Machinery

3650 CHEMICAL AND PHARMACEUTICAL PRODUCTS MANUFACTURING MACHINERY

Chemical and Pharmaceutical Products Manufacturing Machinery

3655 GAS GENERATING AND DISPENSING SYSTEMS, FIXED OR MOBILE

Gas Generating and Dispensing Systems, Fixed or Mobile

3660 INDUSTRIAL SIZE REDUCTION MACHINERY

Industrial Size Reduction Machinery

3680 FOUNDRY MACHINERY, RELATED EQUIPMENT AND SUPPLIES

Foundry Machinery, Related Equipment and Supplies.

3685 SPECIALIZED METAL CONTAINER MANUFACTURING MACHINERY AND RELATED EQUIPMENT

Specialized Metal Container Manufacturing Machinery and Related Equipment

3690 SPECIALIZED AMMUNITION AND ORDNANCE MACHINERY AND RELATED EQUIPMENT

Specialized Ammunition and Ordnance Machinery and Related Equipment

3693 INDUSTRIAL ASSEMBLY MACHINES

Industrial Assembly Machines

3694 CLEAN WORK STATIONS, CONTROLLED ENVIRONMENT, AND RELATED EQUIPMENT

Clean Work Stations, Controlled Environment, and Related Equipment

3695 MISCELLANEOUS SPECIAL INDUSTRY MACHINERY

Miscellaneous Special Industry Machinery

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