Award Notice for Test Vehicle to Study Reliability of Materials Used in Advanced Packaging of Semiconductor Chips 1333ND26PNB030001
Summary
AI-generated · Dec 24, 2025Provide a test vehicle designed to evaluate the reliability of materials used in advanced packaging of semiconductor chips. The award was made on a fixed-price basis to The Research Foundation for The State University of New York through a non-competitive process because only one source could meet NIST requirements, with a contract value of $900,000.
This fixed price contract action was awarded non-competitively because only one source was found capable of meeting the NIST requirements.
From Award Notice posted on Dec 23, 2025Notice history
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Award Notice LATEST Posted Dec 23, 2025
Details
Award Information
Award Notices
Posted: Dec 23, 2025
This fixed price contract action was awarded non-competitively because only one source was found capable of meeting the NIST requirements.
Awardees
| Company Name | UEI | CAGE Code | Location |
|---|---|---|---|
| The Research Foundation for The State University of New York | NQMVAAQUFU53 | 3GRK1 | Binghamton, NY |
Contacts
Agency
Place of Performance
USA