474299: DUNE FD-VD CRP Patch Panel IO-1889-1B PCB Assembly-Request for Quote (RFQ) 474299
Summary
AI-generated · Jan 09, 2026Source sources to provide PCB assembly services for a cryogenic electronics assembly as described in the attached Statement of Work and drawings. This is market research (sources sought/RFI) to plan a potential competitive procurement; no solicitation is currently available. Respondents must submit a Capability Statement showing the ability to meet the SOW requirements, not marketing material, and should address: (1) capability to meet the stated requirements; (2) a minimum of 20 years’ experience with complex PCB assemblies, with reference documentation if a Request for Quote is issued; (3) experience building cryogenic electronics assemblies with roughly 50 different component types, about 1,500 components, including both surface mount and through-hole technologies, with a certificate of compliance per IPC-A-610 Class II and strict ESD handling procedures, plus references for at least three successfully fabricated jobs including board size, component counts, ESD procedures, and evidence of operation at cryogenic temperatures (<120 K); and (4) SAM.gov registration status and the Unique Entity Identifier (UEI). The notice indicates the possibility of a small business set-aside based on responses.
SOURCES SOUGHT NOTICE/REQUEST FOR INFORMATION This is not a Request for Proposal (RFP), Request for Quotation (RFQ), or an Invitation for Bid (IFB). This is a Sources Sought/Request for Information (RFI) ONLY. A solicitation is currently not available. This notice is not to be construed as a commitment, implied or otherwise, to issue a solicitation or ultimately award a contract. The purpose of this Sources Sought Notice is to identify potential sources capable of performing the effort described herein pursuant to FAR Part 10, Market Research and FAR Part 19, Small Business Programs. Information received as a result of this notice will be considered market research and used for planning purposes only. Any information submitted by respondents is strictly voluntary. Any costs incurred as a result of this announcement shall be borne by the responder and will not be charged to BSA for reimbursement. INTRODUCTION: This is the initial step in the planning process for the PCB assembly requirement. Brookhaven Science Associates (BSA) seeks sources with the capability and interest to provide the assembly service as defined in the Statement of Work (SOW), Technical Drawing, and Qualifiers, attached. BSA anticipates conducting a competitive acquisition for this effort. The North American Industry Classification System (NAICS) code is anticipated to be 334418 Printed Circuit Assembly. The size standard for NAICS code 334418 is 750 employees. INSTRUCTIONS: All interested respondents that are capable of providing this service are invited to respond electronically with a Statement of Capabilities (SOC) demonstrating the ability to meet the requirements outlined in the attachments. Do NOT merely reiterate the objectives or reformulate the requirements specified in the SOW or include any marketing material in the capabilities statement. Responses shall include company name, address, SAM Unique Entity Identification (UEI) number, point of contact with email address and telephone number, and indicate business size (large, small business, small disadvantaged business, service-disabled veteran-owned small business, economically disadvantaged woman-owned small business, woman-owned small business, or HUBZone) using NAICS 334412, size standard 750 employees. BSA reserves the right to consider a small business set-aside for any subsequent acquisition based upon responses to this notice. Responses shall address the following areas, at a minimum (Responses shall be sent to Shaylyn Price at sprice@bnl.gov): 1. Describe your company s capability to meet the requirements listed in the DRAFT Statement of Work. 2. Provide confirmation that your company has a minimum of 20 years of working experience in the areas of complex PCB assemblies. Please also confirm that your company can provide reference documentation demonstrating 20+ years of work experience if the Request for Quote is posted. 3. Provide explanation of experience building cryogenic electronics assemblies with similar complexity (~50 different types of components with mix of surface mount and through hole technologies, ~1,500 components, certificate of compliance per IPC-A-610 class II, stringent handling procedure for ESD sensitive components) with reference to the assembly drawing attached. Provide references for at least 3 successfully fabricated jobs with comparable complexity with key parameters listed below. The references shall include the name of the organization, contacts, phone numbers, and email addresses. a. Board size b. Number of different types of components c. Number of components in surface mount technology d. Number of components in through hole technology e. Number of components mounted on board f. Certificate of compliance per IPC-A-610 class II g. Handling procedure for ESD sensitive components h. Evidence of boards being used at cryogenic temperature (< 120 K) 4. Specify if your company is registered in SAM.gov. Please also provide your company s Unique Entity Identification (UEI) number.
From Sources Sought posted on Jan 08, 2026Brookhaven Science Associates, LLC (herein known as BSA ), operator of Brookhaven National Laboratory (BNL) under a Prime Contract with the U.S. Department of Energy (DOE) herewith solicits your quote for the subject requirement as outlined in Enclosure A, Draft Contract 474299. BSA invites you to participate in accordance with the RFQ letter and all supporting enclosures and exhibits. This requirement has been posted on SAM.gov website under Request for Quote (RFQ) 474299. Any questions concerning this RFQ must be addressed via email to the attention of Shaylyn Price at sprice@bnl.gov.
From Solicitation posted on Feb 02, 2026*RFQ 474299 is hereby updated to include the Questions and Answers document and its accompanying attachmetns "Q and A-Samtec ASP-223333-01 Connector", "Q and A-Gerber files for IO-1889-1B , and "Q and A-CORRECTED Exhibit C-Bill of Materials (BOM) IO-1889-1B". Please note due to time constraints, new questions are not accepted past the original question due date of 02/11/2026. Please continue to follow this requirement for future amendments. Brookhaven Science Associates, LLC (herein known as BSA ), operator of Brookhaven National Laboratory (BNL) under a Prime Contract with the U.S. Department of Energy (DOE) herewith solicits your quote for the subject requirement as outlined in Enclosure A, Draft Contract 474299. BSA invites you to participate in accordance with the RFQ letter and all supporting enclosures and exhibits. This requirement has been posted on SAM.gov website under Request for Quote (RFQ) 474299. Any questions concerning this RFQ must be addressed via email to the attention of Shaylyn Price at sprice@bnl.gov.
From Solicitation posted on Feb 12, 2026Notice history
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Solicitation Posted Feb 02, 2026View changes (4)
- Title: 474299 Sources Sought: DUNE FD-VD CRP Patch Panel IO-1889-1B PCB Assembly → 474299: DUNE FD-VD CRP Patch Panel IO-1889-1B PCB Assembly-Request for Quote (RFQ)
- Description: Description was updated
- Notice Type: Sources Sought → Solicitation
- Response Deadline: Jan 16, 2026 → Feb 23, 2026
Details
Award Information
Not yet awarded
Contacts
Agency
Place of Performance
USA