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Special Notice SBA Expired 1 notice 2 documents

Silicon Wafer Ball Bonder 80NSSC25909413Q

Solicitation 80NSSC25909413Q Copied Notice ID 83e98779dd6b46229d2ef5328ff17a9b Copied NATIONAL AERONAUTICS AND SPACE ADMINISTRATION — NASA SHARED SERVICES CENTER
SAM.gov
Posted
Jul 10, 2025
Deadline
Jul 15, 2025
Set-aside
SBA
NAICS
334516
PSC
6640

Summary

AI-generated · Aug 24, 2025

Silicon Wafer Ball Bonder is being procured for NASA/NSSC.

Refer to the attached Statement of Work and capability statement for the detailed requirements and any unique conditions.

NASA/NSSC has a requirement for a Silicon Wafer Ball Bonder. See the attached SOW and capability statement for further details.

From Special Notice posted on Jul 10, 2025

Notice history

1
  1. Special Notice LATEST Posted Jul 10, 2025 View

Details

Solicitation number 80NSSC25909413Q
Notice ID 83e98779dd6b46229d2ef5328ff17a9b
Notice type Special Notice
Product / Service (PSC) 6640
NAICS 334516
Place of performance Huntsville, Alabama
Archive date Jul 30, 2025

Award Information

Not yet awarded

Contacts

primary
Lindsey McLellan

Email

Agency

NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
NASA SHARED SERVICES CENTER

Place of Performance

Huntsville, Alabama 35812
USA

Dates

Posted Jul 10, 2025 1 year ago
Last Updated Aug 06, 2026 2 days ago
Due Jul 15, 2025 1 year ago