Request for Information: Next Generation Microelectronics Manufacturing 3DHI Microsystems DARPA-SN-25-93
Summary
AI-generated · Aug 24, 2025DARPA’s Microsystems Technology Office is seeking information via an RFI to help shape a future Design Challenge aimed at advancing the next generation of 3D heterogeneously integrated (3DHI) microsystems. The effort would provide early access to NGMM-enabled capabilities, with prototypes designed to demonstrate unprecedented performance in 3DHI microelectronics.
The RFI looks for input on which classes of 3DHI microsystems can best utilize the NGMM integration technology roadmap to support innovative commercial and/or dual-use applications. It also seeks to identify organizations interested in employing NGMM’s 3DHI capability, potential barriers to fabricating 3DHI components, and additional offerings that would further promote the use of 3DHI and engagement with NGMM.
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) seeks information to support a future solicitation. This Design Challenge solicitation is intended to advance the next generation of 3D heterogeneously integrated (3DHI) microsystems by enabling early access to the capabilities established under the Next Generation Microelectronics Manufacturing (NGMM) program. The prototypes developed through this effort will demonstrate the unprecedented performance of 3DHI microelectronics. Through this RFI, DARPA aims to solicit further insight into the classes of 3DHI microsystems that can best leverage the NGMM integration technology roadmap to support innovative commercial and/or dual use applications. The goals of this Request for Information (RFI) include, but are not limited to: Identification of innovative applications that can leverage 3DHI Identification of organizations interested in utilizing NGMM s 3DHI capability Identification of potential barriers to fabricating 3DHI components Identification of additional offerings that would further promote both the use of 3DHI and engagement with NGMM
From Special Notice posted on Jul 25, 2025Notice history
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