NGMM Shopping Notice DARPA-SN-26-69
Summary
AI-generated · Apr 17, 2026The NGMM program is actively seeking innovative, post-competitive solutions that use the early-stage NGMM 3D Assembly Design Kit (3D-ADK) to design mixed-material, 3D-heterogeneously integrated microsystems with commercial Electronic Design Automation (EDA) tools. Submissions must be made through the ERIS Marketplace, and proposals will be reviewed on a rolling basis.
The government reserves the right to award one or more contracts before the notice closes, reflecting an immediate search for qualifying solutions.
Between the dates listed above, the DARPA NGMM program will be actively reviewing the ERIS Marketplace for innovative, post-competitive, awardable solutions that exercise the early-stage version of the NGMM 3D Assembly Design Kit (3D-ADK) for mixed-material 3D-heterogeneously integrated (3DHI) microsystem design with commercial Electronic Design Automation (EDA) tools. This is an active and immediate search for solutions. Submissions will be reviewed on a rolling basis, and the Government reserves the right to make one or more awards prior to the closing date of this notice.
From Special Notice posted on Apr 16, 2026Notice history
1Details
Award Information
Not yet awarded