Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture NIST-SS26-CHIPS-04
Summary
AI-generated · Nov 19, 2025Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture are being sought from potential suppliers. Full requirements and detailed specifications are in the attached Sources Sought Notice.
Please see attached Sources Sought Notice (SSN)# NIST-SS26-CHIPS-04 for full details.
From Sources Sought posted on Nov 18, 2025Please see attached Combined Sources Sought Notice (SSN)/Notice of Intent to Sole Source # NIST-SS26-CHIPS-04 for full details.
From Sources Sought posted on Nov 20, 2025Notice history
2-
Sources Sought Posted Nov 18, 2025
-
Sources Sought LATEST Posted Nov 20, 2025View changes (2)
- Title: Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture → Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture - Combined Sources Sought Notice/ Notice of Intent to Sole Source
- Description: Description was updated
Details
Award Information
Not yet awarded
Contacts
Agency
Place of Performance
USA