Sources Sought
Expired
1 notice
1 document
Direct Bonding for Compound Semiconductors W56KGU25RDBCS
Posted
Aug 21, 2025
Deadline
Sep 05, 2025
Set-aside
None
NAICS
N/A
PSC
N/A
Summary
AI-generated · Aug 24, 2025Direct bonding for compound semiconductors is being sought; this Sources Sought aims to identify industry capability and interest for performing direct bonding of compound semiconductor materials. See attached Sources Sought for more information.
See attached Sources Sought for more information.
From Sources Sought posted on Aug 21, 2025Notice history
1Details
Solicitation number
W56KGU25RDBCS
Notice ID
44224447c4f543eba0b1ce162f60203c
Notice type
Sources Sought
Place of performance
Aberdeen Proving Ground, Maryland
Archive date
Sep 20, 2025
Award Information
Not yet awarded
Contacts
primary
Email
Hanh Dinh
Agency
DEPT OF DEFENSE
DEPT OF THE ARMY
AMC
ACC
ACC-CTRS
ACC-APG
W6QK ACC-APG
Place of Performance
USA
Dates
Posted
Aug 21, 2025
11 months ago
Last Updated
Aug 06, 2026
1 day ago
Due
Sep 05, 2025
11 months ago