Automatic Wire Bonder 1333ND26QNB030043

As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses

AMENDMENT 1 TO SOLICITATION 1333ND26QNB030043 Due to Vendor Questions: Vendor Question 1: Can you let me know if the parts will be held on flat boats or manually placed on the workholder? NIST Response: The samples (chips) need to be wire bonder to a 256-pin ceramic package. This ceramic package needs to be affixed to the stage of the bonder for wire bonding. Vendor Question 2: Current Equipment: Are you currently using a manual wire bonder? If so, could you specify the make and model? NIST Response: No Vendor Question 3: Application: What type of bonding applications do you plan to run with the new wire bonder? NIST Response: We are looking to bond a 1 cm2 chip inside a 256-pin double-tiered ceramic package and streamline the process Vendor Question 4: Bonding Tools: Are there specific bonding tools or configurations required for your applications? NIST Response: You will find this information in the Statement of Work. Vendor Question 5: Accessories: Will you need additional items such as a microscope, work holders, or any other accessories? NIST Response: The tool should contain a scope for inspection and a way to fix the sample piece to the stage. As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses